Advanced Packaging Process Engineer at Tenstorrent designing 2.5D/3D chiplet packaging for AI/ML semiconductors. Owns package technology implementation, manages foundry/OSAT partnerships, and drives reliability and manufacturability for high-performance products.
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.
Tenstorrent is seeking an Advanced Packaging Process Engineer with experience in 2.5D and 3D chiplet packaging to join Tenstorrent’s Packaging team. You will drive advanced package technology and reliability in close partnership with foundries and OSATs, helping push performance and manufacturability for next‑generation AI/ML products.
This role is hybrid, based out of Santa Clara, CA or Taipei City, TW.
We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.
Who you are
What we need
What you will learn
Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.
Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.
This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.